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PCBs Repairs with BGA and FC Packages
Buřival, Tomáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Graduation thesis is specialized on dilemma of the integrated circuits with ball grid array. Chapter two describes several types of packages and confrontation of their characteristics. Chapter three considers possibilities of corrections these boards bedded with packages, mounting and demounting of these packages, method of camera control and also inspection of the soldering process. Chapter four attend to practical measuring of thermal profiles and their optimalization.
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Analysis of Defects on PCB Using X-RAY
Mlýnek, Martin ; Vala, Radek (referee) ; Řihák, Pavel (advisor)
This thesis is focused on BGA packages and fault detection after rework using X – Ray. There is a description of BGA packages by carrier substrate, techniques of connecting on chip, from mounting packages to repair printed circuit boards (hereafter PCB). Thesis summarizes description of defects, which are created after rework process. There is also description of X – Ray as method for analyzing defects. X – PLANE method used to detect internal structure of BGA packages and it was confirmed by microsection and by software for reconstruction. Description of automatic and manual measurement is follow.
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Analysis of Defects on PCB Using X-RAY
Mlýnek, Martin ; Vala, Radek (referee) ; Řihák, Pavel (advisor)
This thesis is focused on BGA packages and fault detection after rework using X – Ray. There is a description of BGA packages by carrier substrate, techniques of connecting on chip, from mounting packages to repair printed circuit boards (hereafter PCB). Thesis summarizes description of defects, which are created after rework process. There is also description of X – Ray as method for analyzing defects. X – PLANE method used to detect internal structure of BGA packages and it was confirmed by microsection and by software for reconstruction. Description of automatic and manual measurement is follow.
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PCBs Repairs with BGA and FC Packages
Buřival, Tomáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Graduation thesis is specialized on dilemma of the integrated circuits with ball grid array. Chapter two describes several types of packages and confrontation of their characteristics. Chapter three considers possibilities of corrections these boards bedded with packages, mounting and demounting of these packages, method of camera control and also inspection of the soldering process. Chapter four attend to practical measuring of thermal profiles and their optimalization.
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